UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

NEN-EN-IEC 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

inactive
Organization: NEN
Publication Date: 1 November 1999
Status: inactive
Page Count: 56
ICS Code (Semiconductor devices): 31.080
scope:

Describes a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

Document History

June 1, 2014
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
NEN-EN-IEC 60191-4 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating...
November 1, 2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
April 1, 2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
NEN-EN-IEC 60191-4
November 1, 1999
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal...

References

Advertisement