scope:

This standard is applicable to solderless wrapped connections made with single solid round wires with nominal diameters of 0.25 mm (0.01 in ) minimum and appropriately designed posts for use in telecommunications equipment and in electronic devices employing similar techniques. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. Object: To determine the suitability of solderless wrapped connections under specified mechanical, electrical and atmospheric conditions, to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture.