NEN-EN-IEC 60749-25
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2003 |
| Status: | active |
| Page Count: | 42 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Document History
NEN-EN-IEC 60749-25
November 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature...