NEN-EN-IEC 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2003 |
| Status: | active |
| Page Count: | 42 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Document History
NEN-EN-IEC 60749-14
November 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for...