Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
|Publication Date:||1 November 2003|
|ICS Code (Semiconductor devices in general):||31.080.01|
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.