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NEN-EN-IEC 60749-14

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

active, Most Current
Organization: NEN
Publication Date: 1 November 2003
Status: active
Page Count: 42
ICS Code (Semiconductor devices in general): 31.080.01
scope:

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Document History

NEN-EN-IEC 60749-14
November 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for...
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