NEN-EN-IEC 61192-4
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2003 |
| Status: | active |
| Page Count: | 74 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Document History
NEN-EN-IEC 61192-4
July 1, 2003
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates....