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NEN-EN-IEC 61192-4

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

active, Most Current
Organization: NEN
Publication Date: 1 July 2003
Status: active
Page Count: 74
ICS Code (Electronic component assemblies): 31.190
scope:

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Document History

NEN-EN-IEC 61192-4
July 1, 2003
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates....
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