Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
|Publication Date:||1 July 2003|
|ICS Code (Electronic component assemblies):||31.190|
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.