NEN-EN-IEC 62137-4/C11
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 March 2015 |
| Status: | active |
| Page Count: | 4 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
March 1, 2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
NEN-EN-IEC 62137-4 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical...
NEN-EN-IEC 62137-4/C11
March 1, 2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
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