NEN-EN-IEC 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 February 2001 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Semiconductor devices): | 31.080 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Document History
NEN-EN-IEC 60191-6-3
February 1, 2001
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.