DIN IEC 61191-6
Evaluation criteria for voids in soldered joints of BGA and LGA (IEC 91/707/CD:2007)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2007 |
| Status: | inactive |
| Page Count: | 60 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 61191-6
December 1, 2007
Evaluation criteria for voids in soldered joints of BGA and LGA (IEC 91/707/CD:2007)
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