NEN-EN-IEC 61188-5-4
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 December 2007 |
| Status: | active |
| Page Count: | 29 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Document History
NEN-EN-IEC 61188-5-4
December 1, 2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process....