NEN-EN-IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 2013 |
| Status: | active |
| Page Count: | 58 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.
Document History
NEN-EN-IEC 61191-1
September 1, 2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
January 1, 1999
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Prescribes requirements for materials, methods and verification criteria for producing quality aoldered interconnections and assemblies using surface mounted and related assembly technologies. Also...