NEN-EN-IEC 60749-10
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
inactive
| Organization: | NEN |
| Publication Date: | 1 September 2002 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Describes a shock test intended to determine the suitabilitu of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly of the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.
Document History
July 1, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility...
NEN-EN-IEC 60749-10
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Describes a shock test intended to determine the suitabilitu of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied...