NEN-EN-IEC 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2001 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Provides common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack.
Document History
NEN-EN-IEC 60191-6-8
November 1, 2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Provides common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack.