UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

NEN-IEC 60191-6

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

inactive
Organization: NEN
Publication Date: 1 April 2000
Status: inactive
Page Count: 44
ICS Code (Semiconductor devices): 31.080
scope:

Applies to all surface-mounted devices classified in IEC 191-4 as Form E. Supplements Publications 191-1 and 191-3.

Document History

April 1, 2000
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.
NEN-IEC 60191-6
April 1, 2000
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Applies to all surface-mounted devices classified in IEC 191-4 as Form E. Supplements Publications 191-1 and 191-3.

References

Advertisement