NEN - NPR-IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2007 |
| Status: | inactive |
| Page Count: | 37 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types.
Document History
NPR-IEC/PAS 61249-3-1
July 1, 2007
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types.