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NEN-EN 50310

Application of equipotential bonding and earthing in buildings with information technology equipment

inactive
Organization: NEN
Publication Date: 1 April 2006
Status: inactive
Page Count: 33
ICS Code (Electromagnetic compatibility (EMC)): 33.100
ICS Code (Information technology (IT) in general): 35.020
ICS Code (Electricity supply systems): 91.140.50
scope:

This European Standard applies to the equipotential bonding inside buildings in which information technology equipment is going to be installed. It contributes to the standardisation of information technology equipment and co-ordinates with the pre-requirements of the generic installation conditions as outlined in IEC 60364-5-548 to achieve the following targets: a) safety from electrical hazards; b) reliable signal reference within the entire information technology installation; c) satisfactory electromagnetic performance of the entire information technology installation. A defined bonding configuration down to the equipment level;independent of the equipment Supplier;is intended to facilitate;the installation, operation and maintenance of information technology installations in buildings;;the interworking between different information technology equipment (interconnected by metallic links). The specification of information technology equipment and of the pre-requirements of installation are subject to agreement of the parties (e. g. the equipment supplier and the purchaser or building owner). This standard applies to buildings with information technology equpiment or in which the installation of information technology equipment is intended. It provides additional information for architects of buildings and for designers and installers of electrical installations of buildings on some installation concepts that limit electromagnetic influences. Basic considerations are given here to mitigate such influences that may result in disturbance. This standard does not apply to buildings which may be subject to a harsh electromagnetic environment, or rooms containing the generation, transmission or termination of voltages over AC 1000 V. This standard does not address the specific requirements for telecommunication centres; these are specified in EN 300253.

Document History

February 1, 2020
Telecommunications bonding networks for buildings and other structures
A description is not available for this item.
June 1, 2016
Telecommunications bonding networks for buildings and other structures
This European Standard specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and...
December 1, 2015
Telecommunications bonding networks for buildings and other structures
This European Standard specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and...
November 1, 2010
Application of equipotential bonding and earthing in buildings with information technology equipment
This European Standard specifies minimum requirements for earthing networks and connections (bonds) in buildings in which information technology equipment is intended to be installed to protect that...
June 1, 2009
Application of equipotential bonding and earthing in buildings with information technology equipment
This European Standard specifies minimum requirements for earthing networks and connections (bonds) in buildings in which information technology equipment is intended to be installed to protect that...
NEN-EN 50310
April 1, 2006
Application of equipotential bonding and earthing in buildings with information technology equipment
This European Standard applies to the equipotential bonding inside buildings in which information technology equipment is going to be installed. It contributes to the standardisation of information...
October 1, 2000
Application of equipotential bonding and earthing in buildings with information technology equipment
Applies to the equipotential bonding inside buildings in which information technology equipment is going the be installed.
September 1, 1998
Application of equipotential bonding and earthing at premises with information technology equipment
Applies to the equipotential bonding inside buildings in which information technology equipment is going the be installed.
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