NEN-EN-IEC 60191-6-2
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 May 2002 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and other as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Document History
NEN-EN-IEC 60191-6-2
May 1, 2002
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA),...