NEN-ISO 9453
Soft solder alloys - Chemical compositions and forms of delivery
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 January 1994 |
| Status: | inactive |
| Page Count: | 10 |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
This Standard specifies the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony; - tin-silver, with and without lead; - tin-copper, with and without lead; - tin-antimony; - tin-lead-bismuth; - bismuth-tin; - tin-lead cadmium; - tin-indium; - lead-silver, with and without tin. An indication of the forms generally available is also included.
Document History
NEN-ISO 9453
January 1, 1994
Soft solder alloys - Chemical compositions and forms of delivery
This Standard specifies the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony; - tin-silver, with and without lead; -...