NEN-EN-IEC 61189-6
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 2006 |
| Status: | active |
| Page Count: | 56 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.
Document History
NEN-EN-IEC 61189-6
September 1, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.