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NEN 12326-4

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

active, Most Current
Organization: NEN
Publication Date: 1 April 1997
Status: active
Page Count: 86
ICS Code (Printed circuits and boards): 31.180
scope:

Applies to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for printed boards intended to be accepted under the IEC Quality Assessment System for Electronic Components (IECQ). Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used.

Document History

NEN 12326-4
April 1, 1997
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
Applies to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional...

References

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