NEN-EN-IEC 60749-22
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 54 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This test is intended to be applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-terminal bond inside the package of wire-connected semiconductor devices bonded by sodlering, thermocompression, ultrasonic and other related techniques.
Document History
NEN-EN-IEC 60749-22
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
This test is intended to be applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-terminal bond inside the package of wire-connected semiconductor devices bonded by sodlering,...