NEN-EN-IEC 60749-34
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
inactive
| Organization: | NEN |
| Publication Date: | 1 May 2004 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
Document History
January 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
This part of IEC 60749 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal...
NEN-EN-IEC 60749-34
May 1, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This...