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IEC 61189-2-630

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning

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Organization: IEC
Publication Date: 1 June 2018
Status: active
Page Count: 18
ICS Code (Printed circuits and boards): 31.180
scope:

This document specifies a test method to determine the amount of water absorbed by metalclad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

Document History

IEC 61189-2-630
June 1, 2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning
This document specifies a test method to determine the amount of water absorbed by metalclad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

References

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