AFNOR - NF EN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
active, Most Current
| Organization: | AFNOR |
| Publication Date: | 9 March 2018 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
NF EN IEC 61190-1-3
March 9, 2018
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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