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BSI - BS EN 61188-5-4

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

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Organization: BSI
Publication Date: 31 December 2007
Status: active
Page Count: 18
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61188-5-4
December 31, 2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
A description is not available for this item.

References

This document references:
IEC 61760-1 - Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by IEC on July 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document references:
IEC 60286-4 - Packaging of components for automatic handling – Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by IEC on July 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60286-5 - Packaging of components for automatic handling – Part 5: Matrix trays
Published by IEC on April 1, 2018
This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated...
This document is referenced by:
BS EN 61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Published by BSI on September 30, 2017
A description is not available for this item.
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