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ESD SP27.1

Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers

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Organization: ESD
Publication Date: 30 November 2017
Status: active
Page Count: 19
scope:

This document applies to any electronic component, module, or assembly exhibiting electrically induced physical damage (EIPD) that is suspected to be a result of EOS.

Purpose

This document provides guidance based on a two-level approach that describes what necessary and important information should be shared between automotive original equipment manufacturer (OEM), Tier 1, and semiconductor manufacturers to solve electrical overstress (EOS) issues.

NOTE: Subcontractors are considered to be under the responsibility of the Tier 1 as defined in the OEM statement of work (SoW).

Document History

ESD SP27.1
November 30, 2017
Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers
This document applies to any electronic component, module, or assembly exhibiting electrically induced physical damage (EIPD) that is suspected to be a result of EOS. Purpose This document provides...
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