Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers
|Publication Date:||30 November 2017|
This document applies to any electronic component, module, or assembly exhibiting electrically induced physical damage (EIPD) that is suspected to be a result of EOS.
This document provides guidance based on a two-level approach that describes what necessary and important information should be shared between automotive original equipment manufacturer (OEM), Tier 1, and semiconductor manufacturers to solve electrical overstress (EOS) issues.
NOTE: Subcontractors are considered to be under the responsibility of the Tier 1 as defined in the OEM statement of work (SoW).