TSE - TS EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
active, Most Current
| Organization: | TSE |
| Publication Date: | 28 January 2004 |
| Status: | active |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
Bu standard, alüminyum alaşımından yapılmış kendinden yağlamalı, flanşlı burçların özellikleri ile saftların ve yuvaların tasarım tavsiyelerini kapsar..
Document History
TS EN 60191-6-4
January 28, 2004
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Bu standard, alüminyum alaşımından yapılmış kendinden yağlamalı, flanşlı burçların özellikleri ile saftların ve yuvaların tasarım tavsiyelerini kapsar..