TSE - TS 3552
Heat or Solvent Bonding Enamelled Round Copper Wires With High Mechanical Properties
inactive, Most Current
| Organization: | TSE |
| Publication Date: | 23 January 1981 |
| Status: | inactive |
| ICS Code (Wires): | 29.060.10 |
scope:
Bu standard, TS 18'e uygun bakir iletkenler, ornegin isi veyacozuculerin etkisi ile yapisan bir tabaka ile kaplanmispolivinilas
Document History
TS 3552
January 23, 1981
Heat or Solvent Bonding Enamelled Round Copper Wires With High Mechanical Properties
Bu standard, TS 18'e uygun bakir iletkenler, ornegin isi veyacozuculerin etkisi ile yapisan bir tabaka ile kaplanmispolivinilasetat temelli emay maddesi gibi, emay maddeleriyleemaylanarak yalitilmis...