TSE - TS 4690
Base Materials for Printed Circuits Prepreg for Use As Bonding Sheet Material In the Fabrication of Multilayer Printed Boards
inactive, Most Current
| Organization: | TSE |
| Publication Date: | 11 February 1986 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Bu standard, cok katli baskili devreler olusturmak uzere, metalkapli epoksi cam tabakalardan yapilan baskili devreleri tutturmaktakullanila
Document History
TS 4690
February 11, 1986
Base Materials for Printed Circuits Prepreg for Use As Bonding Sheet Material In the Fabrication of Multilayer Printed Boards
Bu standard, cok katli baskili devreler olusturmak uzere, metalkapli epoksi cam tabakalardan yapilan baskili devreleri tutturmaktakullanilan epoksi recine emdirilmis dokuma cam elyafli...