TSE - TS EN 60749-20
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
inactive
| Organization: | TSE |
| Publication Date: | 28 January 2004 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.
Document History
June 24, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Bu standard, plastik kapsullu yuzeye monte elemanlar (SMD?ler)olarak ambalajlanmis yari iletkenlerin lehim isisinadayanikliliginin degerlendirilmesini kapsar.
March 23, 2010
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
TS EN 60749-20
January 28, 2004
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.