TSE - TS EN 61190-1-1
Attachment materials for electronic assembly ?Part 1-2:Requirements for soldering fluxes for high-quality interconnections in electronics assembly
active, Most Current
| Organization: | TSE |
| Publication Date: | 26 April 2004 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
Bu standard, elektronik montajlarda yuksek kaliteli arabaglantilar icin lehim pastalarinin deneye t?bi tutulmasina vesiniflandirilmasin
Document History
TS EN 61190-1-1
April 26, 2004
Attachment materials for electronic assembly ?Part 1-2:Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Bu standard, elektronik montajlarda yuksek kaliteli arabaglantilar icin lehim pastalarinin deneye t?bi tutulmasina vesiniflandirilmasina iliskin genel ozellikleri kapsar. Bu standard,elektronik...
November 11, 2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002) / Note: Endorsement notice
Bu standard, pvc malzemeden ekstrüde edilmiş, ısıyla büzülemeyen üç tip manşon ile ilgili kuralları kapsar.