IPC - TM-650 2.6.6B
Temperature Cycling, Printed Wiring Board
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 December 1987 |
| Status: | inactive |
| Page Count: | 1 |
scope:
This test is conducted for the purpose of determining the resistance of a material such as a laminate or multilayer circuit board, to the shock of repeated exposures to extremes of high and low temperatures for comparatively short periods of time.
Document History
TM-650 2.6.6B
December 1, 1987
Temperature Cycling, Printed Wiring Board
This test is conducted for the purpose of determining the resistance of a material such as a laminate or multilayer circuit board, to the shock of repeated exposures to extremes of high and low...