IPC - TM-650 2.4.20
Terminal Bond Strength, Flexible Printed Wiring
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 April 1973 |
| Status: | inactive |
| Page Count: | 1 |
scope:
This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
Document History
TM-650 2.4.20
April 1, 1973
Terminal Bond Strength, Flexible Printed Wiring
This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.