scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883. "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 CY7C254 16K × 8 UV EPROM 65 ns 02 CY7C254 16K × 8 UV EPROM 55 ns 03 CY7C254 16K × 8 UV EPROM 45 ns

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style U CQCC1-N32 32 Rectangular leadless chip carrier 1/ X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 1/ Z GDFP2-F28 28 Flat pack 1/

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to Outputs in high Z- - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc Thermal resistance, junction-to-case (θ_JC): Case outlines U, X, and Z - - - - - - - - - - - - See MIL-STD-1835 Maximum power dissipation (P_D) 2/ - - - - - - - - - 1.0 W Maximum junction temperature (T_J) - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - - +260°C Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Temperature under bias range - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - 2.0 V dc minimum Low level input voltage (V_IL) - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C)- - - - - - - - −55°C to +125°C

intended Use: