DS/EN 61192-4
Workmanship requirements for soldered electronic assemblies – Part 4: Terminal assemblies
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| Organization: | DS |
| Publication Date: | 23 May 2003 |
| Status: | inactive |
| Page Count: | 38 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Document History
DS/EN 61192-4
May 23, 2003
Workmanship requirements for soldered electronic assemblies – Part 4: Terminal assemblies
This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of...
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