TSE - TS EN 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
active, Most Current
| Organization: | TSE |
| Publication Date: | 29 November 2001 |
| Status: | active |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
Bu standard analog ve sayısal haberleşme sistemlerinde kullanılan kablolar için mekanik deney metotlarını kapsar.
Document History
TS EN 60191-6-3
November 29, 2001
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
Bu standard analog ve sayısal haberleşme sistemlerinde kullanılan kablolar için mekanik deney metotlarını kapsar.