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IEC/PAS 60191-6-18

Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)

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Organization: IEC
Publication Date: 1 January 2008
Status: inactive
Page Count: 24
ICS Code (Semiconductor devices in general): 31.080.01

Document History

July 1, 2010
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) CORRIGENDUM 2
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
May 1, 2010
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) CORRIGENDUM 1
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
January 1, 2010
Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
IEC/PAS 60191-6-18
January 1, 2008
Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
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