IEC 60749-37
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
active, Most Current
Buy Now
| Organization: | IEC |
| Publication Date: | 1 January 2008 |
| Status: | active |
| Page Count: | 44 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
October 1, 2022
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an...
IEC 60749-37
January 1, 2008
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
A description is not available for this item.