DIN IEC 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2008 |
| Status: | inactive |
| Page Count: | 18 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN IEC 62047-9
March 1, 2008
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
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