DIN IEC 61249-3-1
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 May 2008 |
| Status: | inactive |
| Page Count: | 63 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 61249-3-1
May 1, 2008
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
A description is not available for this item.