AFNOR - NF EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
active
| Organization: | AFNOR |
| Publication Date: | 1 May 2008 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
December 1, 2010
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
NF EN 61190-1-3
May 1, 2008
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
A description is not available for this item.
Related Products
Searching for related products...