scope:

IPC-C-107 is a hardcopy compilation of IPC documents. Documents were reviewed and recommended for inclusion by IPC's technical staff.

These IPC documents can be viewed individually through the appropriate IPC subscriptions in IHS Standards Expert.

4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards

4103A: Specification for Base Materials for High Speed/High Frequency Applications

4104: Specification for high Density interconnect (HDI) and Microvia Materials

4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar

4121: Guidelines for Selecting Core Constructionfor Multilayer Printed Wiring Board Applications

4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

4411A: Specificationand Charaterization Methods for Nonwoven Para-Aramid Reinforcement

4412A: Specification for Finished Fabric Woven From "E" Glass for Printed Boards

4562A: Metal Foil for Printed Board Applications

4563: Resin Coated Copper Foil for Printed Boards Guideline

4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed

4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed

9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test

A-142: Specification for Finished Fabric Soven from Aramid for Printed Boards

CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

SG-141: Specification or Finished Fabric Woven from "S" Glass for Printed Boards

T-50J: Terms and Definiations for Interconnecting and Packaging Electronic Circuits

WP/TR-584A: IPC White Pater and Technical Report on the Use of Halogenated Flame Retardants in Print