DS/EN 62137-1-1
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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| Organization: | DS |
| Publication Date: | 7 September 2007 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components.
The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Document History
DS/EN 62137-1-1
September 7, 2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components.
The method is designed to test and evaluate the endurance of the solder joint between...
May 12, 2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - - Part 1-1: Pull strength test
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