DSF/prEN 62137-1-5
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
| Organization: | DS |
| Status: | inactive |
| Page Count: | 19 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
1.1 Scope
The test method described in this standard shall be applied to a surface mount component with a thin
and wide basal plane, such as BGA. This test method is designed to evaluate the fatigue life of the
solder joints between component leads and lands on a substrate. A temperature cyclic approach is
generally used for evaluating reliability of solder joints. Other approach is to mechanically cycle the
solder joints to shorten the testing time rather than to produce the strains by changing temperatures.
The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion)
mismatch as shown in Figure 2. In place of temperature cycle test, this imposition test is applicable to predict the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs.
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