scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (see 6.4) 1K × 8-Bit power switched bipolar PROM 90 ns 02 (see 6.4) 1K × 8-Bit power switched bipolar PROM 75 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline J D-3 (24-lead, 0.600″ row spacing), dual-in-line package K F-6 (24-lead, 0.640″ × 0.420″ × 0.090″, max), flat package L D-9 (24-lead, 0.300″ row spacing), dual-in-line package X C-12 (32-lead, 0.560″ × 0.458″ × 0.120″, max), rectangular chip carrier package 3 C-4 (28-lead, 0.460″ sq × 0.100″, max), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - - - −0.5 V dc to +7 V dc Address/Enable input voltages - - - - - - - - - - - - - −0.5 V to +5.5 V dc Address/Enable input current - - - - - - - - - - - - - - −30 mA dc to +5.5 mA dc Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering 10 seconds) - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC): Cases J, K, L, X, and 3 - - - - - - - - - - - - - - - See MIL-M-38510, appendix C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Case operating temperature (T_C) - - - - - - - - - - - - −55°C to +125°C

intended Use: