DS/EN 62258-1
Semiconductor die products - Part 1: Requirements for procurement and use
inactive
| Organization: | DS |
| Publication Date: | 1 March 2006 |
| Status: | inactive |
| Page Count: | 46 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information.
Document History
November 5, 2010
Semiconductor die products - Part 1: Procurement and use
IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection...
DS/EN 62258-1
March 1, 2006
Semiconductor die products - Part 1: Requirements for procurement and use
This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached...
Semiconductor devices - Semiconductor die products -- Part 1: Requirements for procurement and use
This International Standard has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers
- singulated bare die
- die and wafers with attached...
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