DS/CWA 15627
Small Punch Test Method for Metallic Materials
| Organization: | DS |
| Publication Date: | 25 January 2008 |
| Status: | inactive |
| Page Count: | 74 |
| ICS Code (Mechanical testing of metals): | 77.040.10 |
scope:
This Code of Practice gives guidance on the procedure to be followed when carrying out Small Punch Creep tests. The objectives of such tests are to evaluate the creep behaviour of materials exposed in operating plant components in order to provide data needed for plant life and integrity assessment. The Code of Practice primarily addresses metallic materials tested under creep loading but can also be used for other materials. Determination of tensile test data at elevated temperature can also be realised using the proposed methodology. But the methodology applied in Part B of this document should be applied. The scope of the Code of Practice covers the following: Test Piece Test pieces are discs of specified dimensions procured from components or any other source. They may be homogeneous or contain manufacturing features such as for example joints, weldments, defects or coatings Load The load may be applied to the disc from a pneumatic, hydraulic or any other mechanical source. The Code of Practice particularly addresses the usual situation where the load is maintained constant throughout the test, but the general principles apply also to tests where the load is cycled, with dwell periods. Temperature The test temperature will usually be within the creep range for the materials under test. The Code of Practice specifically addresses the usual situation where the temperature is maintained constant throughout the test, but the general principles also apply to thermal cycling with or without dwell periods. Environment The test pieces will usually be tested in an inert gas environment. However, the general principles should also apply when other environments are used. Although special precautions will be necessary where hazardous or corrosive environments are used, these are not detailed in this document.
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