IPC - J-STD-003 CHINESE
Solderability Tests for Printed Boards
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| Organization: | IPC |
| Publication Date: | 1 March 2007 |
| Status: | inactive |
| Page Count: | 52 |
scope:
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user.
Document History
January 1, 2014
Solderability Tests for Printed Boards
A description is not available for this item.
J-STD-003 CHINESE
March 1, 2007
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...