scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RNA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DG538AA 8-channel wideband/video multiplexer

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V+ to V− . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to 21 V dc V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to 21 V dc V− to GND . . . . . . . . . . . . . . . . . . . . . . . . −10 V dc to 0.3 V dc Digital inputs . . . . . . . . . . . . . . . . . . . . . (V−) − 0.32 V dc to(V_L−) + 0.3 V dc or 20 mA, whichever occurs first. Digital inputs (V_S, V_D) . . . . . . . . . . . . . . . . . (V−) − 0.32 V dc to (V−) + 21 V dc or 20 mA, whichever occurs first. Current (continuous, any terminal) . . . . . . . . . . . 20 mA Peak current, S or D (pulsed at 1 ms, 10% duty cycle max.). . . . . . . . . 40 mA Power dissipation (P_D) 2/ . . . . . . . . . . . . . . . . 1200 mw Storage temperature range . . . .. . . . . . . . . . . . −65°C to +150°C Junction temperature (T_J) . . . . . . . . . . . . . . . . +150°C Lead temperature (soldering, 10 seconds). . . . . . . . . +300°C

Positive supply voltage (V+) . . . . . . . . . . . . . . +15 V dc Negative supply voltage (V−) . . . . . . . . . . . . . . −3 V dc Logic supply voltage (V_L) . . . . . . . . . . . . . . . +5 V dc Ambient operating temperature range . . . . . . . . . . −55°C to +125°C

intended Use: