DIN IEC 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 February 2009 |
| Status: | inactive |
| Page Count: | 30 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 60191-6-21
February 1, 2009
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
A description is not available for this item.
Related Products
Searching for related products...