UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Webinars & White Papers

BSI - BS 9766

Printed Circuits of Assessed Quality: Sectional Specification for Multilayer Flex- Rigid Printed Circuits with Through Hole Connections

inactive
Buy Now
Organization: BSI
Publication Date: 30 December 1983
Status: inactive
Page Count: 42
ICS Code (Printed circuits and boards): 31.180
scope:

Specifies the tests and requirements from those listed in BS 9760 that are applicable to multilayer flexi-rigid printed circuits with through-hole connections and also the requirements for capability approval and for quality conformance inspection during manufacture.

Document History

BS 9766
December 30, 1983
Printed Circuits of Assessed Quality: Sectional Specification for Multilayer Flex- Rigid Printed Circuits with Through Hole Connections
Specifies the tests and requirements from those listed in BS 9760 that are applicable to multilayer flexi-rigid printed circuits with through-hole connections and also the requirements for capability...

References

Advertisement